經(jīng)濟(jì)型6寸探針臺(tái)MPW-600
● Failure analysis 集成電路失效分析 ??????????
● Wafer level reliability?晶圓可靠性認(rèn)證
● Device characterization 元器件特性量測(cè) ????
● Process modeling?塑性過(guò)程測(cè)試(材料特性分析)
● IC Process monitoring 制程監(jiān)控 ????????
● Package part probing IC封裝階段打線品質(zhì)測(cè)試
● ESD&TDR testing ?ESD和TDR測(cè)試 ?????????????????????
● Microwave probing 微波量測(cè)(高頻)
● Solar太陽(yáng)能領(lǐng)域檢測(cè)分析 ?????????????????????????????
● LED、OLED、LCD領(lǐng)域檢測(cè)分析